The Spring Festival of 2026 is coming, our "Standard PCB" factory will start the Lunar New Year holiday from Feb 15th - Feb 18th (GMT+8). PCBWay remains in partial production throughout the Chinese New Year holiday. Please arrange your orders in advance. Read more >>

Prototype de PCB en toute simplicité

Service complet de prototypage de PCB personnalisé.

Exemple de circuits imprimés fabriqués par nous.

Nous avons les capacités de fabrication de PCB pour construire des planches simples à complexes. Veuillez passer en revue les circuits imprimés ci-dessous et nous faire savoir si vous avez des questions ou si vous souhaitez obtenir un devis officiel.

  • Semiconductor test PCB

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • 5G Internet of Things PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 5G signal test PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

  • 5G mobile phone PCB motherboard

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Mobile phone 3rd-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Automotive communication 2nd-order HDI board

    14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

  • Industrial control 5th-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.8±0.18m

  • Semiconductor test 4th-order HDI board

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • Ipad 3rd-order HDI board

    8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • 10-layer 2nd-order HDI board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • 6th-order arbitrary interconnection HDI buried/blind via circuit board

    14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

  • 4th-order HDI buried/blind via board

    10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 3rd-order HDI board

    8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

  • 3rd-order HDI PCB buried resistor circuit board

    8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

  • 3rd-order 5G IoT HDI PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 2nd-order high speed PCB

    18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm

  • 2nd-order HDI buried/blind via board

    22 layers, Material: TU-883, Thickness: 1.6±0.16mm

  • 2nd-order HDI test board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • Conception et mise en page de circuits imprimés

    PCB design file errors and solutions

  • FPC/R-FPC

    Exigences de conception de la partie flexible du circuit imprimé

1 2 3 4 5 6 7 8 9 10

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

Engineer

Yordanov