Semiconductor test PCB

Produits de PCB / Semiconductor test PCB / Semiconductor test PCB

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Applications

Semiconductor test

Features

4 times laser drilling, 5 times pressing, 4nd order HDI board

Material

S1000-2M

Layers

8 Layers

Thickness

4.4±0.4mm

Min Hole Size

Laser hole 0.127mm; mechanical hole 0.3mm

Min Track/Spacingh

127/85um

Minimum board thickness and hole ratio

15:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Détails du produit

Semiconductor test PCB circuit board, this type of circuit board is made of Shengyi S1000-2M material, manufactured by laser drilling, surface immersion gold and other processes, and the smallest aperture can reach 0.1mm, and the Min Track/Spacing can reach 127/85um. The HDI board is widely used in the field of semiconductor testing.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

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