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The mobile phone's 3rd-order HDI PCB has a Min Track/Spacing of 65/65um and a minimum aperture of 0.1mm. This type of HDI circuit board is widely used in the field of smart phones.

The 7th-order HDI board is widely used in high-end smart phones and other fields
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18m
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm