3rd-order 5G IoT HDI PCB

Produits de PCB / HDI PCB / 3rd-order 5G IoT HDI PCB

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Applications

5G Internet of Things

Features

Material

S1000-2M

Layers

8 Layers

Thickness

1.0±0.1mm

Min Hole Size

Laser hole 0.1mm; mechanical hole 0.20mm

Min Track/Spacingh

55/55um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG)+OSP

Calculer

Détails du produit

The 3rd-order 5G IoT HDI PCB is made of Shengyi S1000-2M material through 8 lamination, surface immersion gold and OSP and other processes. The HDI circuit board is widely used in the field of 5G Internet of Things.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

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