6th-order arbitrary interconnection HDI buried/blind via circuit board

Produits de PCB / HDI PCB / 6th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

Digital products and automotive electronics

Features

Material

S1000-2M

Layers

14 Layers

Thickness

1.6±0.1mm

Min Hole Size

Laser hole 0.15mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG) 0.05um

Calculer

Détails du produit

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

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+86-571-85317532

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