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6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.
The 7th-order HDI board is widely used in high-end smart phones and other fields
12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18m
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm
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Notre service client prêt+86-571-85317532
The board is clean and look great, all the soldering parts and holes are accurate
Vũ Minh
The PCB board work as intended, all the component are in the right place with clean solder
Vũ Minh