10-layer 2nd-order HDI board

Produits de PCB / HDI PCB / 10-layer 2nd-order HDI board

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Applications

Test

Features

Ladder board + ENEPIG + bonding

Material

S1000-2M

Layers

10 Layers

Thickness

1.3±0.13mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

12: 1

Surface Finish

Immersion gold(ENIG) 50u"

Calculer

Détails du produit

10-layer 2nd-order HDI PCB circuit board, the whole board is produced by thick gold plating. It is widely used in chip testing in the field of artificial intelligence and 5G network communication. It is the first choice in the field of artificial intelligence and 5G network communication.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

This new Bat Synth works perfectly

A very, very easy build, and the finished device works perfectly. Note that my photos show a previous generation of the 3D printed case which required a bit of manual trimming around the amp module.

Phil Atkin

Fuse Sensor

Of the 18 boards populated, 1 failed to operate, 1 had issues. The other 16 were operational. The process was pretty seamless - a few issues from my end regarding BOM descriptions, but otherwise all good. I will probably look at some advanced verification next time to ensure better yield rates.

Lucinsky

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Exemple de circuits imprimés fabriqués par nous.