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Full feature custom PCB prototype service.

Some Issues concerning BGA(Ball Grid Array)

Reason of failed review:

1. According to our prototype factory’s production capability, the diameter of BGA pad (round one below) should be at least 0.3mm, the space between copper trace and BGA PAD should be at least 0.2mm, BGA Pad to BGA Pad should be not less 0.35mm.


Suggestions:

You can update the files and resubmit online for checking again if it’s okay to design according to above capability, but if it’s necessary to make such as 0.2mm BGA or something else over our standard requirements above, it’s free to contact your own sales to quote from our high-tech factory.

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