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• The parameters in gerber files are different from the order details online.
• Some Issues concerning BGA(Ball Grid Array)
• Design has no silkscreen layer but online is yes with silkscreen
• The are some pads out of the board outline
• UL Marking
• BGA pad opening
• Spiral coil board
• the spacing requirement from slot to copper trace
• Edge plating
• the spacing requirement from hole to the edge of board
• The spacing from one hole to another is too narrow
• The requirement of beveling on gold finger area
• the spacing from hole to trace
• limited holes spacing
• the bottom silkscreen is mirrored
• notes in the order are different from the designs in the files
• do not design texts on the copper layer
• Silkscreen standard size
• silkscreen size and spacing in solder mask layer