Articles Liés

• The question of component dimension is bigger than the land pattern in the design.
• The question of component dimension don’t match the pads on the boards.
• The question of the component gap don’t match the boards thickness
• The question of component lead pin height don’t match the boards thickness
• The question of component lead pin don’t match pads quantity in the design
• The question of tooling pin/tooling hole
• The question of pin header don’t match the holes on the boards
• The question of Sink Type Micro USB
• The question for holes on pads
• Design issue caused poor soldering
• The question for pin pitch
• Inconformity for component pin distance and the hole space
• Inconformity of solder joints and pads on board
• The question for missing soldermask opening
• The question for LED package
• The question of positioning pin
• The question of silkscreen marking cannot match with the component
• The question of component package
• The question of FPCB stiffener for THT pad