3rd-order 18-layer buried/blind via PCB

Produits de PCB / High-level PCB / 3rd-order 18-layer buried/blind via PCB

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Applications

Chip testing field

Features

3 times laser drilling, 4 times pressing

Material

S1000-2M

Layers

18 Layers

Thickness

2.1±0.21mm

Min Hole Size

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

11:1

Surface Finish

Calculer

Détails du produit

3rd-order 18-layer buried/blind via PCB, mainly used in the field of chip testing.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

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NRF54L15_IOT_Board

The assembled PCBs I ordered from this manufacturer exceeded my expectations in every way. The component placement is accurate and neat, the soldering quality is excellent with no defects, and both SMD and through-hole parts were handled with great precision. The boards look excellent with precise assembly and clean workmanship, showing the manufacturer’s commitment to quality. Delivery was timely, packaging was safe, and communication was smooth throughout. I am highly impressed with their professionalism and would strongly recommend them for complete PCB fabrication and assembly services.

Engineer

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