Produits de PCB - Prototype de PCB personnalisé

All Products PCB Avancé HDI PCB Flexible PCB Rigid-flex board PCB Standard Circuit en aluminium DFM High-level PCB High frequency and high speed PCB Optical module PCB 5G communication PCB Industrial PCB Semiconductor test PCB Aerospace PCB RF antenna PCB UAV PCB Consumer PCB Medical PCB Auto PCB

Structure laminée FPC (flex pcb)

The highest 16-layer Rigid-flex PCB processing technology

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FPC-Structure (1+2F+1)

Surface Finish: ENIG + Silver Paste, Structure:1+2F+1

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Mobile Display & Side Keys_3

Surface Finish:Immersion gold, Structure:1+2F+1

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Mobile Display & Side Keys_2

Rigid-Flex Thickness: 0.295 +/- 0.052mm, Structure:1+2F+1

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Camera Module

4 layers, Structure:(1+2F+1) HDI

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Mobile Display & Side Keys

4 layered HDI with Buried holes, Structure:1-{(2)}-1

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Mobile Bluetooth & USB

0.6mm total thickness, Structure:1-2F-1

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Telecom-8 layered Rigid flex

8 layers, Structure:(2+1+2F+1+2) HDI

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6 layered Rigid flex

6 layers, Structure:1+1+2F+1+1

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FPC 2 layers

2 layers, Material: PI, silver film, Thickness: 0.1mm

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FPC 7 layers

7 layers, Material: PI, FR-4, Thickness: 0.45mm

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FPC 4 Слои-Thickness:1.6mm

4 layers, Material: PI, FR-4, Thickness: 1.6mm

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FPC 10 layers

10 layers, Material: PI, FR-4, Thickness: 2.0mm

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FPC 12 layers

12 layers, Material: PI, FR-4, Thickness: 1.6mm

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FPC 4 layers -Thickness:0.2mm

4 layers, Material: PI, Thickness: 0.2mm

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FPC 4 layers

4 layers, Material: PI, Thickness: 0.8mm

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HDI first-order 8-layer HASL

8 layers, Surface Finish: HASL

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HDI second-order 6-layer immersion gold

6 layers, Поверхностная обработка: immersion gold

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HDI third-order 6-layer immersion gold

6 layers, Surface Finish: immersion gold

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HDI second-order 12-layer immersion gold

12 layers, Surface Finish: immersion gold

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Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

Silicon Carbide Gate Driver Board

PCB was greatly built, and they were delivered on time.

Engineer

MegaWang 2000 Turbo Edition - Super Scaled Sprites

This board worked first time and performs exactly as the design predicted. The assembly was very neat and painless. I'm happy with the sourced components and the speed of delivery. Here is a video to which shows the working board in the rest of the board stack. https://youtu.be/2BH-KohmC6U The soldering is very neat and the board is clean. I'm very happy the board can be produced with a PNP machine and automated assembly.

Piper

Nos capabilités: Capacités des PCB; Service d’assemblage des Cartes de circuits; Fabrication rapide des PCB; Pochoirs CMS; Prototype de Cartes de circuit; Contrôle de la qualité

Produits/Services: Devis immédiat; FAQ sur les Cartes; Prototypage des PCB; Nos équipements; Blog/Ingénierie; Produits de PCB

Soutien à la clientèle: Contact; Centre d'aide; Programme Partenaire; Projets partagés; Glossaire des Cartes de circuits; Programme de référence

À propos de nous: À propos de nous; Pourquoi prendre vos produits chez nous ?; Guide de la méthode d’expédition; Politique de confidentialité; Politique de remboursement; Conditions générales de ventes

Moyens de paiements: Paypal,Western Union,Bank Transfer,WebMoney,Visa,Credit Card

Services de livraison: FedEx,UPS,DHL,China Post Air Mail,TNT,EMS ePacket,Hongkong Post Air Mail,EMS

Vérifié par: Ul Certificate &ISO 9001:2008 Certificate

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PCBWay PCB Prototype the Easy Way!

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Exemple de circuits imprimés fabriqués par nous.

Structure laminée FPC (flex pcb)

FPC-Structure (1+2F+1)

Mobile Display & Side Keys_3

Mobile Display & Side Keys_2

Camera Module

Mobile Display & Side Keys

Mobile Bluetooth & USB

Telecom-8 layered Rigid flex

6 layered Rigid flex

FPC 2 layers

FPC 7 layers

FPC 4 Слои-Thickness:1.6mm

FPC 10 layers

FPC 12 layers

FPC 4 layers -Thickness:0.2mm

FPC 4 layers

HDI first-order 8-layer HASL

HDI second-order 6-layer immersion gold

HDI third-order 6-layer immersion gold

HDI second-order 12-layer immersion gold

Capacités des PCB

Capacités d’assemblage PCB