UAV camera high-density PCB

Produits de PCB / UAV PCB / UAV camera high-density PCB

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Applications

UAV camera field

Features

Dense BGA+ hole to line 0.1mm

Material

S1000-2M+C501

Layers

12 Layers

Thickness

1.6±0.1mm

Min Hole Size

Min Track/Spacingh

70/70um

Minimum board thickness and hole ratio

10.5:1

Surface Finish

Calculer

Détails du produit

The UAV camera high-density PCB is mainly used in the UAV field and used as the UAV camera circuit board. The UAV camera PCB is made of Shengyi S1000-2M material, processed by surface thick gold and other production processes.

Capacités des PCB

Capacités techniques du circuit imprimé Avancé

Structure stratifiée multicouche

Fabrication rapide des PCB

Prototypage des PCB

Production à faible volume

Processus de production

Produits de PCB

Questions recurrentes des PCB

Capacités d’assemblage PCB

Capacité d'assemblage de circuit imprimé

Rappels spéciaux

Exigences relatives aux fichiers

Foire aux questions sur l’assemblage des BPC

Processus de production

Produits d’Assemblage de PCB

Contact!

Notre service client prêt
pour votre carte de circuit imprimé

+86-571-85317532

This new Bat Synth works perfectly

A very, very easy build, and the finished device works perfectly. Note that my photos show a previous generation of the 3D printed case which required a bit of manual trimming around the amp module.

Phil Atkin

Fuse Sensor

Of the 18 boards populated, 1 failed to operate, 1 had issues. The other 16 were operational. The process was pretty seamless - a few issues from my end regarding BOM descriptions, but otherwise all good. I will probably look at some advanced verification next time to ensure better yield rates.

Lucinsky

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